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P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8

Soldering Tools

P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8

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SKU: B 302,TMD,Th,KRT

Rs.700

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SKU: B 302,TMD,Th,KRT
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Category: Soldering Tools
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Tags: P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8

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P3067 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 8

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No Reviews Yet

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