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P3062 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7

Soldering Tools

P3062 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7

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SKU: B 302,TMD,Th,KRT

Rs.700

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SKU: B 302,TMD,Th,KRT
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Category: Soldering Tools
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Tags: P3062 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7

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P3062 IC Chip BGA Reballing Stencil Kits Set Solder Template Multi-Function CPU Tin Steel Net For I Phone 7

Quantity

No Reviews Yet

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Add a review

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